Resistivity/Conductivity: The primary indicator of ionic purity. Ultra-Pure Water (UPW) targets resistivity ≥ 18.2 MΩ·cm at 25°C. Low resistivity signals ionic contamination (e.g., metals, salts).
Total Organic Carbon (TOC): Measures organic contaminants (solvents, oils, bacteria byproducts). High TOC can cause defects, hazing, or interfere with processes. Targets are often in the low parts-per-billion (ppb) range.
Particles: Sub-micron particles (silica, dust) are critical killers in chip manufacturing, causing shorts or opens. Measured by specialized particle counters (e.g., for particles > 0.05 µm).
Silica (Dissolved & Reactive): A major concern as it can form hard scales on wafer surfaces and equipment. Requires tight control in both dissolved and reactive forms.
Specific Ions:
Cations: Sodium (Na⁺), Potassium (K⁺), Calcium (Ca²⁺), Magnesium (Mg²⁺), Iron (Fe²⁺/³⁺), Copper (Cu²⁺), Zinc (Zn²⁺), Aluminum (Al³⁺) - can alter conductivity, cause corrosion, or diffusion issues.
Anions: Chloride (Cl⁻), Sulfate (SO₄²⁻), Nitrate (NO₃⁻), Phosphate (PO₄³⁻) - promote corrosion, particularly of intricate circuitry.
Bacteria (Total Viable Count - TVC): Microbes form biofilms, release organic acids/TOC, and cause particulate contamination. Stringent control (often < 1 CFU/mL) is vital.
Dissolved Oxygen (DO): While sometimes needed in specific steps, excess DO can accelerate corrosion in pipes and distribution systems.
Total Dissolved Solids (TDS): A general measure of all inorganic ions, closely related to conductivity.
Why it Matters: Rigorous, continuous monitoring of these parameters within UPW production (pretreatment, reverse osmosis, EDI, polishing) and distribution loops is non-negotiable. It ensures process stability, maximizes product yield and reliability, protects expensive equipment from scaling and corrosion, and ultimately guarantees the performance of the final electronic components. Failure in water quality equates directly to financial loss and production downtime.